1. Ukukwazi ukuqina
Kunzima ukubhoboza izingxenye ze-ceramic neze-ceramic, ze-ceramic nezensimbi. Iningi le-solder lakha ibhola ebusweni be-ceramic, ngokumanzisa okuncane noma okungenakho nhlobo. Insimbi yokugcwalisa i-brazing engakwazi ukumanzisa i-ceramics kulula ukwakha izinhlobo ezahlukene zamakhemikhali aqhekekile (njenge-carbides, i-silicides kanye namakhemikhali e-ternary noma e-multivariate) esibonakalayo se-joint ngesikhathi se-brazing. Ukuba khona kwala makhemikhali kuthinta izakhiwo zemishini ze-joint. Ngaphezu kwalokho, ngenxa yomehluko omkhulu wama-coefficients okwandisa ukushisa phakathi kwe-ceramic, insimbi kanye ne-solder, kuzoba nokucindezeleka okusele e-joint ngemva kokuba izinga lokushisa le-brazing selipholile liye ekushiseni kwegumbi, okungase kubangele ukuqhekeka kwamalunga.
Ukumanziswa kwe-solder ebusweni be-ceramic kungathuthukiswa ngokungeza izakhi zensimbi ezisebenzayo ku-solder evamile; Izinga lokushisa eliphansi kanye ne-brazing yesikhathi esifushane kunganciphisa umphumela wokusabela kwe-interface; Ukucindezeleka kokushisa kwe-joint kungancishiswa ngokuklama ifomu elifanele le-joint nokusebenzisa insimbi eyodwa noma enezingqimba eziningi njengengqimba ephakathi.
2. I-Solder
I-Ceramic nensimbi kuvame ukuxhunywa ku-vacuum furnace noma ku-hydrogen kanye ne-argon furnace. Ngaphezu kwezici ezijwayelekile, izinsimbi zokugcwalisa i-brazing zamadivayisi kagesi e-vacuum kufanele futhi zibe nezidingo ezithile ezikhethekile. Isibonelo, i-solder akufanele iqukathe izinto ezikhiqiza umfutho ophezulu womusi, ukuze ingabangeli ukuvuza kwe-dielectric kanye nobuthi be-cathode kumadivayisi. Ngokuvamile kucacisiwe ukuthi lapho idivayisi isebenza, umfutho womusi we-solder akufanele udlule ku-10-3pa, kanti ukungcola komfutho ophezulu womusi okuqukethwe kuwo akufanele kudlule ku-0.002% ~ 0.005%; I-w (o) ye-solder akufanele idlule ku-0.001%, ukuze kugwenywe umhwamuko wamanzi okhiqizwa ngesikhathi se-brazing ku-hydrogen, okungase kubangele ukuchitheka kwensimbi ye-solder encibilikisiwe; Ngaphezu kwalokho, i-solder kumele ihlanzeke futhi ingabi nama-oxide angaphezulu.
Uma ufaka insimbi ngemuva kokufaka insimbi ye-ceramic, ithusi, isisekelo, ithusi lesiliva, ithusi legolide kanye nezinye izinsimbi zokugcwalisa insimbi ze-alloy brazing zingasetshenziswa.
Ukuze kufakwe ngqo izinto zobumba nezinsimbi, kuzokhethwa izinsimbi zobumba eziqukethe izinto ezisebenzayo i-Ti ne-Zr. Izinsimbi zobumba ezihlanganisiwe ikakhulukazi i-Ti Cu ne-Ti Ni, ezingasetshenziswa ku-1100 ℃. Phakathi kwe-ternary solder, i-Ag Cu Ti (W) (TI) iyi-solder esetshenziswa kakhulu, engasetshenziswa ekufakweni ngqo kwezinto zobumba nezinsimbi ezahlukahlukene. Insimbi yobumba ehlanganisiwe ingasetshenziswa nge-foil, i-powder noma i-Ag Cu eutectic filler metal ene-Ti powder. Insimbi yobumba ehlanganisiwe ye-B-ti49be2 inokumelana okufanayo kokugqwala nensimbi engagqwali kanye nomfutho ophansi womusi. Ingakhethwa ngokukhethekile ezindaweni zokuvala i-vacuum ezinokumelana nokugqwala nokuvuza. Ku-ti-v-cr solder, izinga lokushisa lokuncibilika liphansi kakhulu (1620 ℃) lapho i-w (V) ingu-30%, futhi ukungezwa kwe-Cr kunganciphisa ngempumelelo izinga lokushisa lokuncibilika. I-B-ti47.5ta5 solder ngaphandle kwe-Cr isetshenziselwe ukufakeni ngqo i-alumina ne-magnesium oxide, futhi ijoyinti layo lingasebenza ekushiseni okujwayelekile okungu-1000 ℃. Ithebula 14 libonisa ukugeleza okusebenzayo kokuxhumana okuqondile phakathi kwe-ceramic nensimbi.
Ithebula 14 izinsimbi zokugcwalisa i-brazing ezisebenzayo zokubopha i-ceramic ne-metal
2. Ubuchwepheshe be-brazing
Izitsha zobumba ezenziwe ngensimbi zingafakwa ebhodweni endaweni ehlanzekile kakhulu, i-hydrogen noma i-vacuum. I-vacuum brazing ivame ukusetshenziselwa ukubhodwa ngqo kwezitsha zobumba ngaphandle kokufakwa kwensimbi.
(1) Inqubo yokubumba yonke inqubo yokubumba yonke ye-ceramic nensimbi ingahlukaniswa ngezinqubo eziyisikhombisa: ukuhlanza ubuso, ukunamathisela, ukwenziwa kwensimbi ebusweni be-ceramic, ukumbozwa kwe-nickel, ukubumba kanye nokuhlolwa kwe-post weld.
Inhloso yokuhlanza ubuso ukususa amabala kawoyela, amabala okujuluka kanye nefilimu ye-oxide ebusweni bensimbi eyisisekelo. Izingxenye zensimbi kanye ne-solder kufanele kuqale kususwe amafutha, bese ifilimu ye-oxide kufanele isuswe ngokuwasha nge-acid noma nge-alkali, kugezwe ngamanzi agobhozayo bese komiswa. Izingxenye ezinezidingo eziphezulu kufanele ziphathwe ngokushisa ku-vacuum furnace noma ku-hydrogen furnace (indlela ye-ion bombardment nayo ingasetshenziswa) ekushiseni okufanele nesikhathi sokuhlanza ubuso bezingxenye. Izingxenye ezihlanziwe akufanele zithinte izinto ezinamafutha noma izandla ezingenalutho. Kufanele zifakwe ngokushesha enqubweni elandelayo noma ku-dryer. Akufanele zivezwe emoyeni isikhathi eside. Izingxenye ze-ceramic kufanele zihlanzwe nge-acetone kanye ne-ultrasonic, zihlanzwe ngamanzi agobhozayo, bese ekugcineni zibiliswa kabili ngamanzi acwengekile imizuzu eyi-15 isikhathi ngasinye.
Ukunamathisela i-paste kuyinqubo ebalulekile yokwenza i-ceramic metallization. Ngesikhathi sokumboza, kufakwa ebusweni be-ceramic ukuze kwenziwe i-metallization ngebhulashi noma umshini wokumboza i-paste. Ubukhulu be-paste ngokuvamile bungu-30 ~ 60mm. I-paste ngokuvamile ilungiswa nge-powder yensimbi emsulwa (ngezinye izikhathi i-metal oxide efanelekile iyengezwa) enosayizi wezinhlayiya ezingaba ngu-1 ~ 5um kanye ne-adhesive yemvelo.
Izingxenye ze-ceramic ezinamathiselwe zithunyelwa esithandweni se-hydrogen bese zigcotshwa nge-hydrogen emanzi noma i-ammonia eqhekekile ku-1300 ~ 1500 ℃ imizuzu engama-30 ~ 60. Ezingxenyeni ze-ceramic ezimbozwe ngama-hydride, kufanele zifudunyezwe cishe ku-900 ℃ ukuze zibole ama-hydride bese zisabela ngensimbi emsulwa noma i-titanium (noma i-zirconium) esele ebusweni be-ceramic ukuze kutholakale ungqimba lwensimbi ebusweni be-ceramic.
Ukuze kube nesendlalelo esenziwe ngensimbi se-Mo Mn, ukuze simanziswe nge-solder, ungqimba lwe-nickel oluyi-1.4 ~ 5um kumele lufakwe ngogesi noma lumbozwe ngesendlalelo se-nickel powder. Uma izinga lokushisa lokubhaka lingaphansi kuka-1000 ℃, ungqimba lwe-nickel ludinga ukushiswa kusengaphambili esithandweni se-hydrogen. Izinga lokushisa nesikhathi sokushisa kungu-1000 ℃ /15 ~ 20min.
Izitsha zobumba ezilungisiwe ziyizingxenye zensimbi, okumele zihlanganiswe zibe yingxube ngensimbi engagqwali noma i-graphite kanye nezimonyo ze-ceramic. I-solder kufanele ifakwe ezinhlanganisweni, futhi umsebenzi kufanele ugcinwe uhlanzekile phakathi nokusebenza, futhi akufanele uthintwe ngezandla ezingenalutho.
Ukushiswa kwensimbi kufanele kwenziwe ku-argon, i-hydrogen noma i-vacuum furnace. Izinga lokushisa lokushiswa kwensimbi lincike ku-brazing filler metal. Ukuze kuvinjelwe ukuqhekeka kwezingxenye ze-ceramic, izinga lokupholisa akufanele lisheshe kakhulu. Ngaphezu kwalokho, ukushiswa kwensimbi kungasebenzisa ingcindezi ethile (cishe u-0.49 ~ 0.98mpa).
Ngaphezu kokuhlolwa kwekhwalithi yobuso, ama-weldment aqinisiwe kufanele futhi abhekane nokushaqeka kokushisa kanye nokuhlolwa kwempahla yemishini. Izingxenye zokuvala zamadivayisi angenawo umoya kumele nazo zihlolwe ukuvuza ngokwemithetho efanele.
(2) Ukushiswa okuqondile lapho ushiswa ngokuqondile (indlela yensimbi esebenzayo), qala uhlanze ubuso bezinto zokushiswa ze-ceramic nezensimbi, bese uzihlanganisa. Ukuze ugweme imifantu ebangelwa ama-coefficients ahlukene okwandisa ukushisa kwezinto zokwakha, ungqimba lwe-buffer (ingqimba eyodwa noma ngaphezulu zamashidi ensimbi) lungajikeleziswa phakathi kwezinto zokushiswa. Insimbi yokushiswa kwe-brazing kufanele iboshwe phakathi kwezinto zokushiswa ezimbili noma ibekwe endaweni lapho isikhala sigcwele khona ngensimbi yokushiswa kwe-brazing ngangokunokwenzeka, bese ukushiswa kwe-brazing kufanele kwenziwe njenge-vacuum brazing evamile.
Uma i-Ag Cu Ti solder isetshenziselwa ukubilisa ngqo, indlela yokubilisa nge-vacuum kufanele isetshenziswe. Lapho izinga lokubilisa esithandweni lifinyelela ku-2.7 × Qala ukushisa ku-10-3pa, futhi izinga lokushisa lingakhuphuka ngokushesha ngalesi sikhathi; Uma izinga lokushisa liseduze nendawo yokuncibilika kwe-solder, izinga lokushisa kufanele liphakanyiswe kancane ukuze izinga lokushisa lazo zonke izingxenye zokubilisa livame ukufana; Lapho i-solder incibilika, izinga lokushisa kufanele liphakanyiswe ngokushesha liye ekushiseni kokubilisa, futhi isikhathi sokubamba kufanele sibe yimizuzu emi-3 ~ 5; Ngesikhathi sokupholisa, kufanele ipholiswe kancane ngaphambi kuka-700 ℃, futhi ingapholiswa ngokwemvelo ngesithando ngemva kuka-700 ℃.
Uma i-Ti Cu esebenzayo ishiswa ngqo, uhlobo lwe-solder lungaba yi-Cu foil kanye ne-Ti powder noma izingxenye ze-Cu kanye ne-Ti foil, noma ubuso be-ceramic bungagqokwa nge-Ti powder kanye ne-Cu foil. Ngaphambi kokushiswa, zonke izingxenye zensimbi kufanele zikhishwe nge-vacuum. Izinga lokushisa lokukhipha igesi lethusi elingenawo umoya-mpilo kufanele libe ngu-750 ~ 800 ℃, kanye ne-Ti, Nb, Ta, njll. kufanele likhishwe ngegesi ku-900 ℃ imizuzu eyi-15. Ngalesi sikhathi, izinga le-vacuum akufanele libe ngaphansi kuka-6.7 × 10-3Pa. Ngesikhathi sokushiswa, hlanganisa izingxenye ezizoshiswa ku-fixture, uzishise esithandweni se-vacuum ku-900 ~ 1120 ℃, futhi isikhathi sokubamba singamaminithi angu-2 ~ 5. Ngesikhathi senqubo yonke yokushiswa, izinga le-vacuum akufanele libe ngaphansi kuka-6.7 × 10-3Pa.
Inqubo yokubrasa yendlela ye-Ti Ni ifana neyendlela ye-Ti Cu, futhi izinga lokushisa lokubhusa lingu-900 ± 10 ℃.
(3) Indlela ye-Oxide brazing Indlela ye-Oxide brazing iyindlela yokuthola uxhumano oluthembekile ngokusebenzisa isigaba sengilazi esakhiwe ukuncibilika kwe-oxide solder ukuze ingene ku-ceramics bese imanzisa ubuso bensimbi. Ingaxhuma i-ceramics ne-ceramics kanye ne-ceramics ngezinsimbi. Izinsimbi ze-Oxide brazing filler zakhiwe kakhulu yi-Al2O3, i-Cao, i-Bao kanye ne-MgO. Ngokufaka i-B2O3, i-Y2O3 kanye ne-ta2o3, izinsimbi ze-brazing filler ezinamaphoyinti ahlukahlukene okuncibilika kanye nama-coefficients okwandayo angatholakala. Ngaphezu kwalokho, izinsimbi ze-fluoride brazing filler ezine-CaF2 kanye ne-NaF njengezingxenye eziyinhloko zingasetshenziswa futhi ukuxhuma i-ceramics nezinsimbi ukuthola amalunga anamandla aphezulu kanye nokumelana nokushisa okuphezulu.
Isikhathi sokuthunyelwe: Juni-13-2022
